Specification:
Brand new
Type: XG-Z40
Alloy: Sn63/Pb37
Microns: 25-45um
Volume: 10CC

Feature:
Excellent wetting and high reliability.
Can effectively prevent the collapse of the printing and preheat.
Viscous force lasting, not easy to dry.
Colorless, does not affect the test, fine-clean and cleaning performance.
White and plump solder joint.
No false welding, strong adhesive with solder iron tip.
Products wetting, anti-dry and strong, long shelf life at room temperature.
Suitable for: mobile phone repair industry, computer digital service industries.
Used to high-precision circuit board soldering SMT, BGA soldering processes, etc. 

Package included:
1pc x solder paste